Reducing Technical Risk Through Advanced Analytical Imaging
Connectivity and sensor technologies
TE Connectivity is a global leader in connectivity and sensor technologies. They sought to evaluate whether advanced imaging technologies could provide a reliable method for assessing adhesive distribution at the bond interface of a biopsy needle assembly. Existing inspection techniques offered limited insight into the inaccessible bond region, creating uncertainty around the feasibility of non-destructive analysis.
The company required independent technical expertise to determine whether emerging imaging technologies could overcome this challenge before committing significant internal resources to further investigation and equipment investment.
Advanced imaging infrastructure
MET Technology Gateway provided TE Connectivity with access to advanced imaging infrastructure and specialist technical expertise to evaluate the feasibility of non-destructive analytical techniques for this challenging application.
Advanced Imaging & Metrology Expertise:
MET assessed the suitability of multiple imaging technologies, providing an objective evaluation of their capabilities and limitations for analysing complex adhesive interfaces.
Independent Technical Assessment:
Rather than simply carrying out testing, MET worked collaboratively with TE Connectivity’s engineering team to interpret the results, discuss alternative approaches and provide evidence-based recommendations.
Risk Reduction Through Evidence:
The investigation allowed TE Connectivity to determine the practical limitations of the selected imaging approach before committing to further internal development or investment.
Knowledge Transfer:
Throughout the engagement, MET shared expertise on emerging analytical technologies, broadening the company’s understanding of available metrology techniques and their future applications.
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Global leader
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Direct funded project
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Analytical investigation
“The collaboration delivered an unexpected benefit by increasing our awareness of the range of metrology and imaging technologies available through MET. The discussions with the technical team helped broaden our understanding of potential future applications and highlighted opportunities for addressing other engineering and quality-related challenges”
Alexander Chan Kai Foong, Quality Engineer, TE Connectivity
TE Connectivity & MET Technology Gateway partnership
The collaboration provided far greater value than simply completing an analytical investigation.
Improved Technical Understanding:
TE Connectivity significantly expanded its understanding of advanced imaging and metrology technologies and how they could be applied to future engineering investigations.
Reducing Technical Risk:
The project demonstrated that the investigated imaging approach would not deliver the required level of information, allowing the company to confidently redirect future analytical efforts.
Informed R&D Decision-Making:
By validating the practical limitations of the technology early, MET enabled evidence-based decisions regarding future analytical strategies while avoiding unnecessary internal investment.
Strengthened Innovation Capability:
The engagement increased awareness of external technical expertise available through MET Technology Gateway, providing a trusted resource for future engineering and quality investigations.
The collaboration between TE Connectivity and MET Technology Gateway demonstrates how access to independent technical expertise and advanced analytical infrastructure can significantly reduce innovation risk.